Electronic devices and methods of manufacturing the same

ABSTRACT

An electronic device includes a dielectric layer including crystal grains having aligned crystal orientations the dielectric layer may be between a substrate and a gate electrode. The dielectric layer may be between isolated first and second electrodes. A method of manufacturing an electronic device may include preparing a substrate having a channel layer, forming the dielectric layer on the channel layer, and forming a gate electrode on the dielectric layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit, under 35 U.S.C. § 119, of KoreanPatent Application No. 10-2019-0131390, filed on Oct. 22, 2019, in theKorean Intellectual Property Office, the disclosure of which isincorporated herein in its entirety by reference.

BACKGROUND 1. Field

The present inventive concepts relate to electronic devices and methodsand/or systems for manufacturing the same, and more particularly, toelectronic devices including a dielectric layer having controlledcrystal orientations and methods and/or systems for manufacturing theelectronic devices.

2. Description of the Related Art

The conventional silicon-based electronic devices have limitations inimproving the operating characteristics and scaling down. For example,when operating voltage and current characteristics are measured in aconventional silicon-based logic transistor, the subthreshold swing (SS)is known to be limited to about 60 mV/dec. The limitation as such may bean inhibiting factor of lowering the operating voltage to about 0.8 V orless when the size of the logic transistor decreases, and accordingly,the power density increases, thereby limiting the scaling down of thelogic transistor.

SUMMARY

Some example embodiments provide electronic devices including adielectric layer having controlled crystal orientations and methodsand/or systems for manufacturing the electronic device.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of some example embodiments of the disclosure.

According to some example embodiments, an electronic device may includea substrate, a dielectric layer on the substrate, and a gate electrodeon the dielectric layer. The dielectric layer may include crystal grainshaving aligned crystal orientations.

The electronic device may further include a channel layer on thesubstrate, wherein the channel layer is overlapped with the gateelectrode in a direction that is perpendicular to a top surface of thesubstrate, and a source and a drain are provided on opposite sides ofthe channel layer in a direction that is parallel to the top surface ofthe substrate.

The channel layer may include at least one of Si, Ge, SiGe, Group III-Vsemiconductors, oxide semiconductors, nitride semiconductors, oxynitridesemiconductors, 2D semiconductor materials, quantum dots, or organicsemiconductors.

The dielectric layer may include a ferroelectric substance.

The dielectric layer may include an oxide of at least one of Hf, Si, Al,Zr, Y, La, Gd, or Sr.

The dielectric layer may further include a dopant.

The dielectric layer may have a thickness, in a direction that isperpendicular to a top surface of the substrate, of about 0.5 nm toabout 4 nm.

The crystal grains may have <111> crystal orientations.

The electronic device may further include an amorphous dielectric layeror a crystalline dielectric layer between the substrate and thedielectric layer, between the dielectric layer and the gate electrode,or combinations thereof. The crystalline dielectric layer includescrystal grains having crystal orientations that are different from thealigned crystal orientations of the crystal grains of the dielectriclayer.

The amorphous dielectric layer may include an oxide of at least one ofHf, Si, Al, Zr, Y, La, Gd, or Sr.

The crystalline dielectric layer may include a 2D insulator material.

According to some example embodiments, an electronic device may includea first electrode and a second electrode isolated from direct contactwith each other; and a dielectric layer between the first electrode andthe second electrode. The dielectric layer may include crystal grainshaving aligned crystal orientations.

The first electrode and the second electrode include crystal grainshaving crystal orientations that are different from the aligned crystalorientations of the crystal grains of the dielectric layer.

The dielectric layer may include a ferroelectric substance.

The electronic device may further include an amorphous dielectric layeror a crystalline dielectric layer between the first electrode and thedielectric layer, between the second electrode and the dielectric layer,or combinations thereof. The crystalline dielectric layer may includecrystal grains having crystal orientations different from the alignedcrystal orientations of the crystal grains of the dielectric layer.

According to some example embodiments, a method of manufacturing anelectronic device may include preparing a substrate having a channellayer, forming a dielectric layer on the channel layer, wherein thedielectric layer includes crystal grains having aligned crystalorientations, and forming a gate electrode on the dielectric layer.

The method may further include forming an amorphous dielectric layer ora crystalline dielectric layer between the substrate and the dielectriclayer, between the dielectric layer and the gate electrode, orcombinations thereof. The crystalline dielectric layer may includecrystal grains having crystal orientations different from the alignedcrystal orientations of the crystal grains of the dielectric layer.

The forming of the dielectric layer may include depositing an amorphousdielectric material layer on the channel layer, and then crystallizingthe amorphous dielectric material layer to form the dielectric layer,such that the crystallized amorphous dielectric material layer includesthe crystal grains having the aligned crystal orientations.

The dielectric layer may include a ferroelectric substance.

The dielectric layer may have a thickness of about 0.5 nm to about 4 nm.

According to some example embodiments, a method of manufacturing acomputing device may include manufacturing an electronic deviceaccording to some example embodiments, and forming the computing devicebased on incorporating the electronic device into a computing devicecomponent.

The computing device component may include at least one of a processingcircuitry or a memory.

According to some example embodiments, a method of manufacturing anelectronic device may include forming a dielectric layer on a firstelectrode, and forming a second electrode on the dielectric layer. Thefirst electrode and the second electrode may include a conductive metal.The dielectric layer may include crystal grains having aligned crystalorientations.

The method may further include forming at least one amorphous dielectriclayer between the first electrode and the dielectric layer, between thedielectric layer and the second electrode, or combinations thereof.

The method may further include forming at least one crystallinedielectric layer between the first electrode and the dielectric layer,between the dielectric layer and the second electrode, or combinationsthereof. The at least one crystalline dielectric layer may includecrystal grains having crystal orientations different from the alignedcrystal orientations of the crystal grains of the dielectric layer.

The forming of the dielectric layer may include depositing an amorphousdielectric material layer on the first electrode, and then crystallizingthe amorphous dielectric material layer to form the dielectric layer,such that the crystallized amorphous dielectric material layer includesthe crystal grains having the aligned crystal orientations.

According to some example embodiments, a method of manufacturing acomputing device may include manufacturing an electronic deviceaccording to the some example embodiments, and forming the computingdevice based on incorporating the electronic device into a computingdevice component.

The computing device component may include at least one of a processingcircuitry or a memory.

According to some example embodiments, a system for manufacturing anelectronic device may include a process chamber including a pedestal orchuck configured to structurally support one or more devices or layersin the process chamber. The system may include a plurality ofcomposition sources and a plurality of control devices, each compositionsource coupled to the process chamber via a separate control device,each control device configured to control a supply of a separatematerial held in a separate coupled composition source to the processchamber. The system may include processing circuitry configured tocontrol at least the plurality of control devices to manufacture theelectronic device based on preparing a substrate having a channel layeron the pedestal or chuck, forming a dielectric layer on the channellayer, wherein the dielectric layer includes crystal grains havingaligned crystal orientations, and forming a gate electrode on thedielectric layer.

The processing circuitry may be further configured to control at leastthe plurality of control devices to form at least one amorphousdielectric layer between the substrate and the dielectric layer, betweenthe dielectric layer and the gate electrode, or combinations thereof.

The processing circuitry may be further configured to control at leastthe plurality of control devices to form at least one crystallinedielectric layer between the substrate and the dielectric layer, betweenthe dielectric layer and the gate electrode, or combinations thereof.The at least one crystalline dielectric layer may include crystal grainshaving crystal orientations different from the aligned crystalorientations of the crystal grains of the dielectric layer.

The forming of the dielectric layer may include depositing an amorphousdielectric material layer on the channel layer, and then crystallizingthe amorphous dielectric material layer to form the dielectric layer,such that the crystallized amorphous dielectric material layer includesthe crystal grains having the aligned crystal orientations.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of some exampleembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a cross-sectional view illustrating an electronic deviceaccording to some example embodiments;

FIG. 2 is an enlarged cross-sectional view of a dielectric layerillustrated in FIG. 1;

FIG. 3 is a graph illustrating an improved subthreshold swing (SS)characteristic of the electronic device according to some exampleembodiments;

FIG. 4 is a cross-sectional view illustrating the electronic deviceaccording to some example embodiments;

FIG. 5 is a cross-sectional view illustrating the electronic deviceaccording to some example embodiments; and

FIGS. 6A, 6B, 6C, and 6D are diagrams illustrating a method ofmanufacturing an electronic device according to some exampleembodiments.

FIG. 7 shows a schematic of a system configured to control themanufacturing of an electronic device according to some exampleembodiments;

FIG. 8 shows a schematic of an electronic device that may include theelectronic device according to some example embodiments;

FIG. 9 shows a schematic of a system configured to control themanufacturing of an electronic device according to some exampleembodiments; and

FIG. 10 is a flowchart illustrating a method implemented by the systemillustrated in FIG. 9 to manufacture an electronic device according tosome example embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to example embodiments, some ofwhich are illustrated in the accompanying drawings, wherein likereference numerals refer to like elements throughout.

In this regard, some example embodiments may have different forms andshould not be construed as being limited to the descriptions set forthherein.

Accordingly, some example embodiments are merely described below, byreferring to the figures, to explain aspects.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items (e.g., A, B, and C).

Expressions such as “at least one of,” when preceding a list ofelements, modify the entire list of elements and do not modify theindividual elements of the list. For example, “at least one of A, B, andC,” and “at least one of A, B, or C” may be construed as covering anyone of the following combinations: A; B; A and B; A and C; B and C; andA, B, and C.”

Hereinafter, what is described as “on top of” or “over” may include notonly directly over (e.g., overlapping in a vertical direction) and incontact but also overlying where intervening elements and/or spaces arepresent. When an element or layer is referred to as being “on” or“above” another element or layer, the element or layer may be directlyon the other element or layer (e.g., in direct contact therewith), orthe element or layer may be indirectly on the other element or layer(e.g., isolated from direct contact with the other element or layer byone or more interposing spaces and/or structures). Where an element isdescribed as being directly between two other elements, the element maybe in direct contact with each of the two other elements, for exampleopposite sides or surfaces of the element may each be in direct contactwith a separate element of the two other elements.

Singular expressions include plural expressions unless the contextclearly indicates otherwise. The use of the term “the” and similarterminology may be used in the singular and the plural. In regard to thesteps constituting a method, unless there are explicit descriptions onorders or otherwise, the steps may be performed in a suitable order. Itis not necessarily limited to the order described in connection with thesteps. The use of all examples or example terms is merely for thepurpose of describing technical concepts in detail, and the examples orexample terms would not limit the range unless they are limited by theclaimed range.

In addition, when a part is said to “include” a certain component, thismeans that it may further include other components, and not excludeother components unless otherwise stated. The use of the term “above”and similar terminology may be used in the singular and the pluralforms. If the steps constituting the method are not explicitly stated ashaving a respective order or as having a contrary to the respectiveorder, the steps may be performed in a suitable order. It is notnecessarily limited to the order provided in the description of theabove steps. The use of all examples or example terms is merely for thepurpose of describing technical concepts in detail, and the scope of thepresent disclosure is not to be limited by the use of the examples orexample terms unless defined by the claims.

It will be understood that elements and/or properties thereof may berecited herein as being “the same” or “equal” as other elements, and itwill be further understood that elements and/or properties thereofrecited herein as being “the same” as or “equal” to other elements maybe “the same” as or “equal” to or “substantially the same” as or“substantially equal” to the other elements and/or properties thereof.Elements and/or properties thereof that are “substantially the same” asor “substantially equal” to other elements and/or properties thereofwill be understood to include elements and/or properties thereof thatare the same as or equal to the other elements and/or properties thereofwithin manufacturing tolerances and/or material tolerances. Elementsand/or properties thereof that are the same or substantially the same asother elements and/or properties thereof may be structurally the same orsubstantially the same, functionally the same or substantially the same,and/or compositionally the same or substantially the same.

It will be understood that elements and/or properties thereof (e.g.,structures, properties of one or more elements, lengths, distances,energy levels, energy barriers, or the like) described herein as beingthe “substantially” the same encompasses elements and/or propertiesthereof (e.g., structures, properties of one or more elements, lengths,distances, energy levels, energy barriers, or the like) that are thesame within manufacturing tolerances and/or material tolerances and/orelements and/or properties thereof (e.g., structures, properties of oneor more elements, lengths, distances, energy levels, energy barriers, orthe like) that have a relative difference in magnitude that is equal toor less than 10%. Further, regardless of whether elements and/orproperties thereof (e.g., structures, properties of one or moreelements, lengths, distances, energy levels, energy barriers, or thelike) are modified as “substantially,” it will be understood that theseelements and/or properties thereof (e.g., structures, properties of oneor more elements, lengths, distances, energy levels, energy barriers, orthe like) should be construed as including a manufacturing oroperational tolerance (e.g., ±10%) around the stated elements and/orproperties thereof (e.g., structures, properties of one or moreelements, lengths, distances, energy levels, energy barriers, or thelike).

When the terms “about” or “substantially” are used in this specificationin connection with a numerical value, it is intended that the associatednumerical value include a tolerance of ±10% around the stated numericalvalue. When ranges are specified, the range includes all valuestherebetween such as increments of 0.1%.

Where elements, properties, or the like are described herein to have a“small” or “very small” difference between each other, it will beunderstood that a variation between the magnitudes of said elementsand/or properties may be equal to or less than 10% of the magnitudes ofthe elements, properties, or the like being described.

Throughout the specification, it will be understood that, although theterms first, second, etc. may be used herein to describe variouselements, these elements, should not be limited by these terms. Theseterms are only used to distinguish one element from another element.

It will be understood that, where an element, layer, structure, or thelike is described herein to be “made of” and/or “formed of” one or morematerials, the element, layer, structure, or the like may “at leastpartially comprise” said one or more materials.

FIG. 1 is a cross-sectional view illustrating an electronic device 100according to some example embodiments. The electronic device 100illustrated in FIG. 1, as a semiconductor-based device, may have a gatestack structure having a ferroelectric substance and a gate electrode.The electronic device 100 as such may be, for example, a logic device ora memory device.

Referring to FIG. 1, the electronic device 100 includes a substrate 110,an amorphous dielectric layer 130, a dielectric layer 140, and the gateelectrode 150. A channel layer 115 is at a position corresponding to thegate electrode 150 on (e.g., on top of) the substrate 110 (e.g., channellayer 115 may be overlapped, also referred to herein as being aligned,with the gate electrode 150 in a direction that is perpendicular to atop surface 110S of the substrate 110, such as the Z-direction shown inFIG. 1), and a source S 121 and a drain D 122 may be provided at (e.g.,on, directly contacting, etc.) both (e.g., opposite) sides of thechannel layer 115 in a direction that is parallel to the top surface110S of the substrate 110 (e.g., the X-direction shown in FIG. 1). Asshown in FIG. 1, source 121 may be electrically connected to one side ofthe channel layer 115, and the drain 122 may be electrically connectedto the other, opposite side of the channel layer 115. The source 121 anddrain 122 may be formed based on implanting impurities into differentregions of the substrate 110, and the region of the substrate 110between the source 121 and the drain 122 in a direction that is parallelto the top surface 110S of the substrate 110 (e.g., the X-directionshown in FIG. 1) may be defined as the channel layer 115. Accordingly,the channel layer 115 may be a portion of the substrate 110 having sideboundaries defined by the source 121 and the drain 122, a bottomboundary 115B defined by the bottom boundaries 121 B and 122B of thesource 121 and drain 122, a top surface 115S of the channel layer 115may be a portion (e.g., limited portion) of the top surface 110Sextending between the source 121 and the drain 122. The portions of thetop surface 110S that are top surfaces of one of the source 121 or thedrain 122 may be exposed from layers 130-150, as shown in FIG. 1. Such achannel layer 115 that is a portion of the substrate 110 will beunderstood to be “on” the substrate 110.

As shown in FIG. 1, the source 121 and drain 122 may be on oppositesides of the channel layer 115 in a direction that is parallel to thetop surface 110S of the substrate 110 (e.g., the X-direction shown inFIG. 1). The depth of the channel layer 115 may be defined by the depthof the source 121 and the drain 122 from a top surface 110S of thesubstrate 110 a direction extending perpendicular to surface 110S, whichmay be the Z-direction shown in FIG. 1. As shown in FIG. 1, each oflayers 130-150 may be at least partially vertically overlapped (e.g.,may completely overlap as shown in FIG. 1) with the channel layer 115(e.g., overlapping in a direction extending perpendicular to surface110S, which may be the Z-direction shown in FIG. 1), and the source 121and the drain 122 may be exposed (e.g., completely exposed as shown inFIG. 1) by the stack of layers 130-150.

The substrate 110 may be, in some example embodiments, a Si substrate,but may be a substrate including materials other than Si, such as Ge,SiGe, Group III-V semiconductors, oxide semiconductors, nitridesemiconductors, oxynitride semiconductors, two-dimensional (2D)semiconductor materials, quantum dots, or organic semiconductors, anycombination thereof, or the like. In some example embodiments, thechannel layer 115, which may be part of the substrate 110 as shown inFIG. 1 or a separate piece of material in relation to the substrate 110,may include at least one of Si, Ge, SiGe, Group III-V semiconductors,oxide semiconductors, nitride semiconductors, oxynitride semiconductors,two-dimensional (2D) semiconductor materials, quantum dots, or organicsemiconductors. The materials of the substrate 110 are not limitedthereto, and may be variously changed.

In some example embodiments, as described below, the channel layer 115may be formed as a material layer being separate from the substrate 110(e.g., a separate piece of material in relation to the substrate 110)instead of the material layer being part of the substrate 110 (e.g., thechannel layer 115 being a portion of a single piece of material that atleast partially comprises the substrate 110) as shown in FIG. 1. Theamorphous dielectric layer 130 is provided on top of the surface of thechannel layer 115 of the substrate 110 (e.g., the portion of surface110S that extends between the source 121 and the drain 122 and definesthe upper boundary of the channel layer 115). Accordingly, it will beunderstood that the amorphous dielectric layer 130 may be on (e.g.,directly on) the substrate 110.

The amorphous dielectric layer 130 may include, for example, an oxide ofat least one of Hf, Si, Al, Zr, Y, La, Gd, or Sr, but is not limitedthereto. The amorphous dielectric layer 130 may be deposited on top ofthe channel layer 115 of the substrate 110 (e.g., directly on, and incontact with, the portion of surface 110S that defines a top surface115S of the channel layer 115 as shown in FIG. 1) by deposition methodssuch as chemical vapor deposition (CVD), atomic layer deposition (ALD),physical vapor deposition (PVD), or the like.

In addition, the dielectric layer 140 including crystal grains havingaligned crystal orientations 140 a (e.g., at least some, or all, of thecrystal grains may have crystal orientations that may be aligned, e.g.,may extend in parallel, a particular direction) is provided on top ofthe amorphous dielectric layer 130 (e.g., directly on a top surface 130Sof the amorphous dielectric layer 130). The amorphous dielectric layer130 is provided between (e.g., directly between as shown in FIG. 1) thechannel layer 115 and the dielectric layer 140 of the substrate 110(e.g., in direct contact with both surfaces 110S and 140B), thereby theamorphous dielectric layer 130 is unaffected by the crystal structure ofthe substrate 110, and the amorphous dielectric layer 130 may beconfigured to assist the crystal grains of the dielectric layer 140 tohave the crystal orientations 140 a aligned to a particular (or,alternatively, predetermined) direction. In some example embodiments,the amorphous dielectric layer 130 may be between the dielectric layer140 and the gate electrode 150 (e.g., directly therebetween). In someexample embodiments, an electronic device 100 may include a firstamorphous dielectric layer 130 between (e.g., directly between) thechannel layer 115 and the dielectric layer 140, and a second amorphousdielectric layer between (e.g., directly between) the dielectric layer140 and the gate electrode 150. In some example embodiments, theamorphous dielectric layer 130 may be absent from the electronic device100, such that dielectric layer 140 may be on, or directly on thesubstrate 110 (e.g., in direct contact with the portion of surface 110Sdefining a top surface 115S of the channel layer 115). In some exampleembodiments a crystalline dielectric layer may be included in theelectronic device 100 in any of the positions described above withregard to the amorphous dielectric layer 130 (e.g., the electronicdevice 100 may include at least one crystalline dielectric layer insteadof at least one amorphous dielectric layer 130). Accordingly, it will beunderstood that the electronic devices according to any of the exampleembodiments may include at least one amorphous dielectric layer (e.g.,130) or at least one crystalline dielectric layer, where the at leastone amorphous dielectric layer (e.g., 130) or at least one crystallinedielectric layer may be between the dielectric layer (e.g., 140) and afirst layer (e.g., substrate 110), between the dielectric layer (e.g.,140) and a second layer at an opposite side of the dielectric layer(e.g., gate electrode 150), or combinations thereof (e.g., a firstamorphous dielectric layer or crystalline dielectric layer between thedielectric layer 140 and the substrate 110 and a second amorphousdielectric layer or crystalline dielectric layer between the dielectriclayer 140 and the gate electrode 150).

FIG. 2 is an enlarged cross-sectional view of the dielectric layerillustrated in FIG. 1. Referring to FIG. 2, the dielectric layer 140 mayinclude a plurality of crystal grains 141 defined by grain boundaries141 a.

Here, the crystal grains 141 constituting the dielectric layer 140 mayhave crystal orientations 140 a of FIG. 1 aligned to a particular (or,alternatively, predetermined) direction. In FIG. 2, reference 140 brepresents the crystal planes of the crystal grains 141 constituting(e.g., at least partially comprising) the dielectric layer 140, and ingeneral, the crystal planes 140 b may be perpendicular to the crystalorientations 140 a. The crystal planes 140 b may be parallel to eachother. The crystal grains 141 constituting the dielectric layer 140 mayhave, for example, <111> crystal orientations. <111> represents Millerindex indicating the crystal orientations in crystallography.

Here, the <111> crystal orientation is representative of, for example,[111], [−111], [1-11], [11-1], [−1-11], [−11-1], [1-1-1], and/or[−1-1-1] crystal orientations. However, this is merely an example andthe crystal grains 141 constituting the dielectric layer 140 may havecrystal orientations other than the <111> crystal orientation.

The dielectric layer 140 may include (e.g., at least partially comprise)the ferroelectric substance.

The ferroelectric substance has a crystalline material structure,wherein the charge distribution within the unit cell in the crystallinematerial structure is non-centrosymmetric, thereby the ferroelectricsubstance has an electric dipole, i.e., spontaneous polarization.

The ferroelectric substance has remnant polarization caused by dipoleeven in the absence of an external electric field. In addition, thedirection of polarization may switch to units of domains by the externalelectric field. The ferroelectric substance may or may not havehysteresis characteristics depending on the external electric field. Insome example embodiments, the dielectric layer 140 may not include anyferroelectric substance.

The dielectric layer 140 may include, for example, an oxide of at leastone of Hf, Si, Al, Zr, Y, La, Gd, or Sr, but this is merely an example.In addition, the dielectric layer 140 may further include a dopant, butexample embodiments are not limited thereto. Here, the dopant mayinclude, for example, at least one of Si, Al, Zr, Y, La, Gd, Sr, or Hf.When the dopant is included in the dielectric layer 140, the dopant maybe doped having the same concentration as a whole, or having differentconcentrations depending on the regions of the dielectric layer 140.

In addition, different doping materials may be doped depending on theregions of the dielectric layer 140. As described below, the dielectriclayer 140 may be formed based on depositing an amorphous dielectricmaterial layer on top of the amorphous dielectric layer 130 (e.g.,directly on the top surface 130S) based on deposition methods such aschemical vapor deposition (CVD), atomic layer deposition (ALD), physicalvapor deposition (PVD), or the like, and then crystallizing thereof. Asthe amorphous dielectric material layer is crystallized based onannealing, the crystal grains 141 having the crystal orientations 140 aaligned in particular (or, alternatively, predetermined) directions,including for example aligned in a single, particular, direction, maygrow to form the dielectric layer 140 having the controlled crystalorientations 140 a. The dielectric layer 140 may have a thickness 140Tof about 0.5 nm to about 4 nm, for example, but example embodiments arenot limited thereto. The gate electrode 150 is provided on (e.g., on topof) the dielectric layer 140 (e.g., directly on top surface 140S).

The gate electrode 150 may be positioned (e.g., may be configured) toface the channel layer 115 of the substrate 110 (e.g., to overlap,partially or completely, with the channel layer 115 in the Z-directionthat is perpendicular to top surface 110S). The gate electrode 150 assuch may include a conductive metal. Here, the gate electrode 150 mayhave crystal orientations different from the crystal orientation(s) ofthe dielectric layer 140. The electronic device 100 according to someexample embodiments has the ferroelectric substance constituting thedielectric layer 140, thereby lowering the subthreshold swing (SS) ofthe electronic device 100. Accordingly, performance of the electronicdevice 100 may be improved based on including the ferroelectricsubstance including crystal grains having aligned crystal orientations(e.g., crystal grains oriented in a particular, e.g., singular, samedirection, crystal grains oriented in parallel in a particulardirection, etc.)

FIG. 3 is a graph illustrating the improved subthreshold swing (SS)characteristic of a logic transistor (e.g., the electronic device shownin FIGS. 1-2 that includes a dielectric layer including crystal grainshaving aligned crystal orientations) according to some exampleembodiments. In FIG. 3, curve “A” illustrates operating voltage (Vg) andcurrent (Id) characteristics of a conventional silicon-based logictransistor (e.g., conventional silicon-based electronic device), andcurve “B” illustrates operating voltage (Vg) (e.g., in mV) and current(Id) (e.g., in A/μm²) characteristics of the logic transistor (e.g.,electronic device) according to some example embodiments of the presentdisclosure. Referring to FIG. 3, a conventional silicon-based transistorhas the subthreshold swing (SS) known to be limited to about 60 mV/decat room temperature (300K).

The logic transistor (e.g., electronic device) according to some exampleembodiments of the present disclosure includes a ferroelectric layer,thereby voltage amplification is generated by negative capacitanceeffect, and thereby the subthreshold swing SS for the logic transistoraccording to some example embodiments that includes a ferroelectriclayer, as shown in curve “B” may be lowered, in relation to thesubthreshold swing for a conventional silicon-based logic transistor asshown in curve “A”, to about 60 mV/dec or less. The electronic device100 according to some example embodiments includes the dielectric layer140 having the ferroelectric substance, wherein the ferroelectricsubstance has the crystal grains 141 having the aligned crystalorientations 140 a, and thereby the polarization characteristics of thedielectric layer 140 and the performance of the electronic device 100may be improved. In the conventional electronic device having aferroelectric substance, crystal grains of the ferroelectric substanceare arranged in random directions. However, in the electronic device 100according to some example embodiments of the present disclosure, thedielectric layer 140 includes the ferroelectric substance, wherein theferroelectric substance includes the crystal grains 141 having thealigned crystal orientations 140 a, thereby the dielectric layer 140 mayhave relatively larger remnant polarization than the conventionalelectronic device, and thereby the polarization characteristics of thedielectric layer 140 may be improved.

In addition, in the electronic device 100 according to some exampleembodiments, polarization directions of the dielectric layer 140 arealigned in a particular direction, thereby depolarization field isincreased, and thereby the negative capacitance effect may be increased.Accordingly, the subthreshold swing SS of the electronic device 100 maybe lowered (e.g., below about 60 mV/dec), and thereby the performance ofthe electronic device 100 may be further improved. In the exampleembodiments shown in FIGS. 1-2, the amorphous dielectric layer 130provided between the channel layer 115 of the substrate 110 and thedielectric layer 140 has been described, but a crystalline dielectriclayer (not shown) may be provided between the channel layer 115 of thesubstrate 110 and the dielectric layer 140, in addition to or in placeof the amorphous dielectric layer 130, as described herein. Accordingly,the layer shown with label “130” in FIG. 1 (and the similar layers 330,430 shown in FIGS. 4, 5, and 6B-6D) may be a crystalline dielectriclayer instead of an amorphous dielectric layer. Here, the crystallinedielectric layer may include crystal grains having crystal orientationsdifferent from the crystal orientations of the crystal grains of thedielectric layer 140 thereon.

The crystalline dielectric layer, like the amorphous dielectric layer130 described above, may be provided between the channel layer 115 ofthe substrate 110 and the dielectric layer 140, and thereby thecrystalline dielectric layer may be unaffected by the crystal structureof the substrate 110 and assist the crystal grains of the dielectriclayer 140 to have the crystal orientations 140 a aligned to a particular(or, alternatively, predetermined) direction. The crystalline dielectriclayer may be located between (e.g., directly between) the channel layer115 and the dielectric layer 140, between (e.g., directly between) thedielectric layer 140 and the gate electrode 150, or combinations thereof(e.g., there may be multiple separate crystalline dielectric layers inthe electronic device 100).

The crystalline dielectric layer may include, for example, a 2Dinsulator material such as hexagonal-Boron Nitride (h-BN), or the like.However, this is merely an example, and the crystalline dielectric layermay include various other dielectric materials.

In the above, the amorphous dielectric layer 130 or the crystallinedielectric layer provided between the channel layer 115 of the substrate110 and the dielectric layer 140 has only been described, but theamorphous dielectric layer 130 or the crystalline dielectric layer maybe additionally provided between the dielectric layer 140 and the gateelectrode 150 (e.g., directly between the dielectric layer 140 and thegate electrode 150). The amorphous dielectric layer 130 or thecrystalline dielectric layer may not be provided between the channellayer 115 of the substrate 110 and the dielectric layer 140, but may beprovided between the dielectric layer 140 and the gate electrode 150.The amorphous dielectric layer 130 or the crystalline dielectric layermay be a plurality of separate layers, where one layer (e.g., a firstlayer) is between the channel layer 115 and the dielectric layer 140,and another layer (e.g., a second layer) is between the dielectric layer140 and the gate electrode 150.

In some example embodiments, the dielectric layer 140 is directlyprovided on top of the channel layer 115 of the substrate 110 (e.g., isin direct contact with the top surface 115S of the channel layer 115),wherein the dielectric layer 140 includes the crystal grains 141 havingcrystal orientations 140 a aligned to a direction different from thecrystal orientations of crystal grains of the substrate 110.

The amorphous dielectric layer 130 or the crystalline dielectric layerdescribed above may not be provided. In other words, the dielectriclayer 140 including the crystal grains 141 having the aligned crystalorientations 140 a may be directly provided on top of the channel layer115 of the substrate 110.

Here, the dielectric layer 140 may include the crystal grains 141 havingaligned crystal orientations 140 a arranged to different directions fromthe crystal orientations of the substrate 110.

FIG. 4 is a cross-sectional view illustrating the electronic deviceaccording to some example embodiments.

The following description will focus on differences from theabove-described example embodiments. Referring to FIG. 4, an electronicdevice 200 includes a substrate 210, a channel layer 215, the amorphousdielectric layer 130, the dielectric layer 140, and the gate electrode150. A source electrode 221 and a drain electrode 222 may be provided atboth (e.g., opposite) sides of the channel layer 215.

The substrate 210 may include, but is not limited to, at least one ofSi, Ge, SiGe, Group III-V semiconductors, oxide semiconductors, nitridesemiconductors, oxynitride semiconductors, 2D semiconductor materials,quantum dots, organic semiconductors, or the like. The channel layer 215may be provided on (e.g., directly on, as shown in FIG. 4) the topsurface of the substrate 210, although example embodiments are notlimited thereto.

The channel layer 215 may be provided as a material layer being separatefrom the substrate 210 that is not part of the substrate 210 (e.g., ispart of a separate piece of material in relation to the substrate 210).The channel layer 215 may include, for example, at least one of an oxidesemiconductor, a nitride semiconductor, an oxynitride semiconductor, atwo-dimensional material (2D material), a quantum dot, or an organicsemiconductor. Here, the oxide semiconductor may include, for example,InGaZnO, and the two-dimensional material may include, for example,transition metal dichalcogenide (TMD) or graphene, and the quantum dotsmay include colloidal QDs, nanocrystal structures, or the like.

However, this is merely an example and some example embodiments are notlimited thereto. The source electrode 221 and the drain electrode 222may be provided at both (e.g., opposite) sides of the channel layer 215.The source electrode 221 may be connected to one side of the channellayer 215, and the drain electrode 222 may be connected to the other,opposite side of the channel layer 215.

The source electrode 221 and the drain electrode 222 may be formed of(e.g., may at least partially comprise) a conductive material such as ametal, a metal compound, or a conductive polymer. Since the amorphousdielectric layer 130, the dielectric layer 140, and the gate electrode150 sequentially stacked on top of the channel layer 215 have beendescribed above, a detailed description thereof is omitted.

The crystalline dielectric layer (not shown) may be provided on (e.g.,on top of) the channel layer 215 (e.g., directly on the top surface 215Sof the channel layer 215) instead of the amorphous dielectric layer 130.Here, the crystalline dielectric layer may include the crystal grainshaving crystal orientations different from the crystal grains of thedielectric layer 140 thereon.

FIG. 5 is a cross-sectional view illustrating the electronic deviceaccording to some example embodiments. The electronic device 300illustrated in FIG. 5 may be, for example, a capacitor. Referring toFIG. 5, the electronic device 300 includes a first electrode 310 and asecond electrode 320 spaced apart from each other (e.g., isolated fromdirect contact with each other) in the Z-direction, which may be adirection perpendicular to the top surface of one or both of the firstor second electrodes 310 or 320 (e.g., one or both of top surfaces 310S,320S), and an amorphous dielectric layer 330 and a dielectric layer 340provided between (e.g., directly between) the first electrode 310 andthe second electrode 320. The amorphous dielectric layer 330 may beprovided on top of the first electrode 310 (e.g., directly on the topsurface 310S), and the dielectric layer 340 may be provided between(e.g., directly between) the amorphous dielectric layer 330 and thesecond electrode 320 (e.g., such that the dielectric layer 340 may be indirect contact with a bottom surface 320B of the second electrode 320).Here, the dielectric layer 340 may include the ferroelectric substanceaccording to any example embodiments, but example embodiments are notlimited thereto and in some example embodiments the dielectric layer 340may not include any ferroelectric substances. The first electrode 310and the second electrode 320 may each include the conductive metal. Insome example embodiments, the amorphous dielectric layer 330 may beabsent, and the dielectric layer 340 may be between (e.g., directlybetween) the first and second electrodes 310 and 320 (e.g., in directcontact with both surfaces 310S, 320B at opposite sides of thedielectric layer 340).

In some example embodiments, the electronic device 300 may be thecapacitor having a metal-ferroelectric-insulator-metal (MFIM) structure.The 310 may include a semiconductor, and the second electrode 320 mayinclude the conductive metal. In such case, the electronic device 300may be the capacitor having ametal-ferroelectric-insulator-semiconductor (MFIS) structure.

The amorphous dielectric layer 330 is provided on (e.g., directly on)the top surface 310S of the first electrode 310. The amorphousdielectric layer 330 may include, for example, an oxide of at least oneof Hf, Si, Al, Zr, Y, La, Gd, or Sr, but is not limited thereto. Theamorphous dielectric layer 330 as such may be deposited on the topsurface 310S of the first electrode 310 by, for example, depositionmethods such as chemical vapor deposition (CVD), atomic layer deposition(ALD), physical vapor deposition (PVD), or the like.

The amorphous dielectric layer 330 is provided between the firstelectrode 310 and the dielectric layer 340 (e.g., directlytherebetween), and thereby the amorphous dielectric layer 330 isunaffected by the crystal structure of the first electrode 310 and maybe configured to assist the crystal grains of the dielectric layer 340to have crystal orientations 340 a aligned to a particular (or,alternatively, predetermined) direction. The dielectric layer 340 isprovided on top of the amorphous dielectric layer 330.

In some example embodiments, the dielectric layer 340 may include thecrystal grains having the crystal orientations 340 a aligned to aparticular (or, alternatively, predetermined) direction according to anyof the example embodiments, including any of the example embodiments ofdielectric layer 140. The crystal grains constituting the dielectriclayer 340 may have, for example, <111> crystal orientations, but are notlimited thereto. In addition, the dielectric layer 340 may include thecrystal grains having the crystal orientations such that said crystalorientations are different from the crystal orientations of the firstelectrode 310 and the second electrode 320. Restated, the firstelectrode 310 and the second electrode 320 may each have crystal grainshaving crystal orientations that are different from the aligned crystalorientations of the crystal grains of the dielectric layer 340.

The dielectric layer 340 may include, for example, an oxide of at leastone of Hf, Si, Al, Zr, Y, La, Gd or Sr, but this is merely an example.The dielectric layer 340 may further include the dopant. Here, thedopant may include, for example, at least one of Si, Al, Zr, Y, La, Gd,Sr, or Hf. The dielectric layer 340 may have, for example, a thickness340T of about 0.5 nm to about 4 nm.

In the electronic device 300 according to some example embodiments, theferroelectric substance of the dielectric layer 340 has the crystalgrains having aligned crystal orientations 340 a, thereby the dielectriclayer 340 has a larger remnant polarization than conventional electronicdevices, thereby the polarization characteristics of the dielectriclayer 340 may be improved, and thereby the capacitance thereof may beincreased accordingly. In the above, the amorphous dielectric layer 330provided between the first electrode 310 and the dielectric layer 340has been described, but the crystalline dielectric layer (not shown) maybe provided between the first electrode 310 and the dielectric layer340. Here, the crystalline dielectric layer may include crystal grainshaving crystal orientations different from the aligned crystalorientations of the crystal grains of the dielectric layer 340 thereon.For example, the crystalline dielectric layer may include atwo-dimensional insulating material such as h-BN, or the like. However,this is merely an example, and the crystalline dielectric layer mayinclude various other dielectric materials.

In the above, the amorphous dielectric layer 330 or the crystallinedielectric layer are provided between the dielectric layer 340 and thefirst electrode 310 has been described, but the amorphous dielectriclayer 330 or the crystalline dielectric layer may be additionallyprovided between the dielectric layer 340 and the second electrode 320.A crystalline dielectric layer may be located between (e.g., directlybetween) the channel layer 215 and the dielectric layer 340, between(e.g., directly between) the dielectric layer 340 and the secondelectrode 320, or any combination thereof (e.g., there may be multipleseparate crystalline dielectric layers in the electronic device 300). Insome example embodiments, an electronic device 300 may include at leastone amorphous dielectric layer 330 or crystalline dielectric layer.

In some example embodiments, the amorphous dielectric layer 330 or thecrystalline dielectric layer may not be provided between the firstelectrode 310 and the dielectric layer 340, but may be provided betweenthe dielectric layer 340 and the second electrode 320. In such case, thedielectric layer 340 is directly provided on the top surface 310S of thefirst electrode 310, wherein the dielectric layer 340 includes thecrystal grains having the crystal orientations aligned to a directiondifferent from the crystal orientations of the first electrode 310. Theamorphous dielectric layer 330 or the crystalline dielectric layerdescribed above may not be provided. In such case, the dielectric layer340 is directly provided on the top surface 310S of the first electrode310, wherein the dielectric layer 340 includes the crystal grains havingthe crystal orientations 340 a aligned to a direction different from thecrystal orientations of the first electrode 310. When the firstelectrode 310 and the second electrode 320 each include the conductivemetal, the capacitor having a metal-ferroelectric-metal (MFM) structuremay be provided, and when the first electrode 310 and the secondelectrode 320 include the semiconductor and the conductive metal, thecapacitor having a metal-ferroelectric-semiconductor (MFS) structure maybe provided.

FIG. 6A 6B, 6C, and FIG. 6D are diagrams for describing a method ofmanufacturing the electronic device according to some exampleembodiments.

Referring to FIG. 6A, a substrate 410 having a channel layer 415, asource S 421, and a drain D 422 is prepared. The source 421 and thedrain 422 may be formed by implanting/doping impurities in differentregions from each other of the substrate 410, where said regions areisolated from each other in the X-direction (e.g., a direction parallelto the top surface 410S of the substrate 410, and the region of thesubstrate 410 between the source 421 and the drain 422 may be defined asthe channel layer 415. The substrate 410 may include, for example, Si,Ge, SiGe, Group III-V semiconductors, oxide semiconductors, nitridesemiconductors, oxynitride semiconductors, two-dimensional (2D)semiconductor materials, quantum dots, or organic semiconductors, anycombination thereof, or the like. In some example embodiments, thechannel layer 415 may include Si, Ge, SiGe, Group III-V semiconductorsoxide semiconductors, nitride semiconductors, oxynitride semiconductors,two-dimensional (2D) semiconductor materials, quantum dots, or organicsemiconductors, any combination thereof, or the like. The material ofthe substrate 410 is not limited to the above and may be variouslychanged. As shown in FIG. 6A, the channel layer 415 may be part of asame piece of material as the remainder of the substrate 410, such thatthe channel layer 415 may be defined as a region of the substrate 410that has side and bottom boundaries in the substrate 410 that aredefined at least partially by the source 421 and the drain 422 and has atop boundary that is a portion of the top surface 410S extending betweenthe source 421 and drain 422, such portion of the top surface 410S beingreferred to herein as a top surface 415S of the channel layer 415. Thechannel layer 415 may be referred to as being formed “on” the substrate410, even though the channel layer 415 and the remainder of thesubstrate 410 may be part of a single piece of material.

The formation time of the source 421 and the drain 422 may vary.

For example, the source 421 and the drain 422 may be formed on thesubstrate 410 after a gate electrode 450 shown in FIG. 6D, which will bedescribed later, is formed. The channel layer 415 may be formed on topof the substrate 410 as a material layer being separate from thesubstrate 410 that is not part of the substrate 410 (e.g., the channellayer 415 may be a separate piece of material in relation to thesubstrate 410). In such case, the material composition of the channellayer 415 may vary in relation to the material composition of thesubstrate 410. For example, the channel layer 415 may include at leastone of an oxide semiconductor, a nitride semiconductor, a nitride oxidesemiconductor, a 2D material, a quantum dot, or an organicsemiconductor. The oxide semiconductor may include, for example, InGaZnOor the like, and the two-dimensional material may include, for example,TMD or graphene, and the quantum dot may include a colloidal quantumdot, a nanocrystalline structure, or the like, but this is merely anexample, and some example embodiments are not limited thereto.

Referring to FIG. 6B, an amorphous dielectric layer 430 is formed on(e.g., on top of) the channel layer 415 of the substrate 410, forexample directly on the channel layer 415 such that the amorphousdielectric layer 430 is in direct contact with top surface 415S. Here,the amorphous dielectric layer 430 may include, for example, an oxide ofat least one of Hf, Si, Al, Zr, Y, La, Gd, or Sr, but exampleembodiments are not limited thereto. The amorphous dielectric layer 430may be provided between (e.g., directly between) the channel layer 415of the substrate 410 and the dielectric layer 440 thereof describedlater, and thus the amorphous dielectric layer 430 is unaffected by thecrystal structure of the substrate 410 and may be configured to assistthe crystal grains of the dielectric layer 440 to have the crystalorientations 440 a of FIG. 6C aligned to a particular (or,alternatively, predetermined) direction.

The amorphous dielectric layer 430 may be deposited on top of thechannel layer 415 of the substrate 410 (e.g., directly on the topsurface 415S) based on, for example, deposition methods such as chemicalvapor deposition (CVD), atomic layer deposition (ALD), physical vapordeposition (PVD), or the like. The amorphous dielectric layer 430 may beformed based on treating the top surface 410S of the substrate 410using, for example, SC1 solution, or may be formed by oxygenating thetop surface 410S of the substrate 410 and then heating the top surface410S of the substrate 410.

In some example embodiments, the formation of the amorphous dielectriclayer 430 may be omitted, and the dielectric layer 440 formed as shownin FIG. 6C may be formed directly on the channel layer 415 (e.g.,directly on the top surface 415S).

Referring to FIG. 6C, the dielectric layer 440 is formed on (e.g., ontop of) the amorphous dielectric layer 430. For example, as shown, thedielectric layer 440 may be formed directly on the top surface 430S ofthe amorphous dielectric layer 430.

Here, the dielectric layer 440 may include crystal grains having thecrystal orientations 440 a aligned in particular (or, alternatively,predetermined) directions as described with regard to any exampleembodiments.

The crystal grains constituting the dielectric layer 440 may have, forexample, <111> crystal orientations, but are not limited thereto. Thedielectric layer 440 may include the ferroelectric substance asdescribed with regard to any example embodiments.

The dielectric layer 440 may include an oxide of at least one of Hf, Si,Al, Zr, Y, La, Gd, or Sr, but this is merely an example. The dielectriclayer 440 may further include a dopant. Here, the dopant may include,for example, at least one of Si, Al, Zr, Y, La, Gd, Sr, or Hf. When thedopant is included in the dielectric layer 440, the dopant may be dopedhaving the same concentration as a whole (e.g., a concentration of thedopant throughout the dielectric layer 440 is uniform or substantiallyuniform), or having different concentrations depending on the regions ofthe dielectric layer 440 (e.g., non-uniform concentration of dopantthroughout the dielectric layer 440). Different doping materials may bedoped depending on the regions of the dielectric layer 440 (e.g., thedielectric layer 440 may include different doping materials in differentregions of the dielectric layer 440).

The dielectric layer 440 may be formed based on depositing an amorphousdielectric material layer on the channel layer 415 (e.g., on top of theamorphous dielectric layer 430, for example directly on the top surface430S), and then crystallizing the amorphous dielectric material layersuch that the crystallized amorphous dielectric material layer includescrystal grains having aligned crystal orientations, such that thecrystallized amorphous dielectric material layer is the dielectric layer440. In some example embodiments, the amorphous dielectric materiallayer is deposited directly on the top surface 415S of the channel layer415 and crystallized to form the dielectric layer 440. Here, theamorphous dielectric material layer may be deposited on top of theamorphous dielectric layer 430 (e.g., directly on the top surface 430S)and/or on the channel layer 415 based on, for example, chemical vapordeposition (CVD), atomic layer deposition (ALD), physical vapordeposition (PVD), or the like. In addition, the amorphous dielectricmaterial layer may be formed as the dielectric layer 440 by beingcrystallized through annealing. During the crystallization of theamorphous dielectric material layer, the crystal grains having thecrystal orientations 440 a aligned to a particular (or, alternatively,predetermined) direction may grow to form the dielectric layer 440, suchthat the crystallized amorphous dielectric material layer is thedielectric layer 440.

The formation of the dielectric layer 440 may depend on the materialconstituting the dielectric layer 440, the type and concentration of thedopant, the annealing temperature, or the like. The annealingtemperature of the amorphous dielectric material layer may be, forexample, from about 300° C. to about 1000° C., but is not limitedthereto. The dielectric layer 440 may be formed having a thickness 440Tof about 0.5 nm to about 4 nm, but this is merely an example.

Referring to FIG. 6D, the electronic device 400 is completed based onforming the gate electrode 450 on top of the dielectric layer 440 (e.g.,directly on top surface 440S. The gate electrode 450 may be formed basedon depositing the conductive material on top of the dielectric layer 440(e.g., directly on the top surface 440S) based on, for example, chemicalvapor deposition (CVD), physical vapor deposition (PVD), atomic layerdeposition (ALD), or the like.

In such case, annealing may be additionally performed after the gateelectrode 450 is formed.

Here, the gate electrode 450 may include crystal grains having crystalorientations different from the aligned crystal orientations of thedielectric layer 440. In the above, the dielectric layer 440 is providedbased on forming the amorphous dielectric material layer on top of theamorphous dielectric layer 430, and then crystallizing the amorphousdielectric material layer by annealing before forming the gate electrode450 thereon.

However, some example embodiments are not limited thereto, and thedielectric layer 440 may be provided based on forming the amorphousdielectric material layer on top of the amorphous dielectric layer 430,then depositing the conductive material thereon to form the gateelectrode 450, and then annealing. In such case, the dielectric layer440 may be formed based on the crystallization of the amorphousdielectric material layer by annealing (e.g., based on application ofheat to the amorphous dielectric material layer from a heat source asdescribed herein). In the above, although at least one amorphousdielectric layer 430 formed on top of the channel layer 415 of thesubstrate 410 has been described, at least one crystalline dielectriclayer (not shown) may be formed instead of the amorphous dielectriclayer 430, such that the layer “430” shown in FIGS. 6B-6D may be acrystalline dielectric layer instead of an amorphous dielectric layer430.

Here, the crystalline dielectric layer may include crystal grains havingcrystal orientations different from the aligned crystal orientations ofthe crystal grains of the dielectric layer 440. In the above, althoughthe amorphous dielectric layer 430 or the crystalline dielectric layerformed between the channel layer 415 of the substrate 410 and thedielectric layer 440 have been described, the amorphous dielectric layer430 or the crystalline dielectric layer may be additionally formedbetween the dielectric layer 440 and the gate electrode 450. Meanwhile,the amorphous dielectric layer 430 or the crystalline dielectric layermay not be formed between the channel layer 415 of the substrate 410 andthe dielectric layer 440, and may be formed only between the dielectriclayer 440 and the gate electrode 450. In such case, the dielectric layer440 is directly formed on top of the channel layer 415 of the substrate410, wherein the dielectric layer 440 includes the crystal grains havingthe crystal orientations 440 a aligned to a direction different from thecrystal orientations of the substrate 410. The amorphous dielectriclayer 430 or the crystalline dielectric layer described above may not beprovided. In such case, the dielectric layer 440 is formed directly ontop of the channel layer 415 of the substrate 410, wherein thedielectric layer 440 includes the crystal grains having the crystalorientations 440 a aligned to a direction different from the crystalorientations of the substrate 410. According to the above embodiments,the subthreshold swing of the electronic device may be lowered by theferroelectric substance included within the dielectric layer.

In addition, a ferroelectric substance may be included in the dielectriclayer 440 and the ferroelectric substance may include the crystal grainshaving the aligned crystal orientations, thereby increasing the remnantpolarization thereof, and thereby improving the polarizationcharacteristics of a ferroelectric thin film. In addition, thepolarization directions are aligned, thereby increasing thedepolarization field, thereby lowering the subthreshold swing byincreasing the negative capacitance effect, and thereby furtherimproving the performance of the electronic device. It should beunderstood that some example embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each exampleembodiment should typically be considered as available for other similarfeatures or aspects in other embodiments.

It will be understood that the electronic devices 100, 200, and 300 maybe formed (e.g., manufactured) via a method that is similar to themethod shown in FIGS. 6A-6D. For example, with regard to the electronicdevice 300 shown in FIG. 5, a method for manufacturing the electronicdevice 300 may include providing a first electrode 310 that is asdescribed above with reference to FIG. 5. In addition, the method formanufacturing the electronic device 300 may include forming a dielectriclayer 340 on the first electrode 310 via a method similar or the same asthe process for forming the dielectric layer 440 as described above withreference to FIG. 6C, where the dielectric layer 440 includes crystalgrains having aligned crystal orientations. The dielectric layer 340 maybe formed directly on the first electrode 310 (e.g., directly on the topsurface 310S thereof) or on an amorphous dielectric layer 330 or acrystalline dielectric layer that is formed between the first electrode310 and the dielectric layer 440. In some example embodiments, formingthe dielectric layer 340 may include depositing an amorphous dielectricmaterial layer on the first electrode 310 (e.g., directly on the firstelectrode 310, directly on an amorphous dielectric layer 330 that is onthe first electrode 310, etc.), and then crystallizing the amorphousdielectric material layer to form the dielectric layer 340 (e.g., basedon generating heat at a heat source such that the heat is applied to theamorphous dielectric material layer to implement annealing and thuscrystallization of the amorphous dielectric material layer, such thatthe crystallized amorphous dielectric material layer includes thecrystal grains having the aligned crystal orientations 340 a. Inaddition, the method for manufacturing the electronic device 300 mayinclude forming a second electrode 320 on the dielectric layer 340 via amethod similar or the same as the process for forming the gate electrode450 as described above with reference to FIG. 6D.

In some example embodiments, the method of forming the electronic device300 may include forming an amorphous dielectric layer 330 on the firstelectrode 310 via a method similar or the same as the process forforming the amorphous dielectric layer 430 as described above withreference to FIG. 6B.

It will be understood that the amorphous dielectric layers 130, 330, 430as shown in FIGS. 1-2, 3-6 may be replaced by a crystalline dielectriclayer as described herein according to some example embodiments (e.g.,between the channel layer 115 and dielectric layer 140 as described withregard to the amorphous dielectric layer 130). In some exampleembodiments, at least one amorphous dielectric layer 330 (and/or atleast one crystalline dielectric layer) may be formed between the firstelectrode 310 and the dielectric layer 340 as shown in FIG. 5, betweenthe dielectric layer 440 and the second electrode 320, or combinationsthereof (e.g., multiple amorphous dielectric layers and/or crystallinedielectric layers may be formed between different sets of layers asdescribed herein).

FIG. 7 shows a schematic of a system 1301 configured to control theformation (also referred to herein interchangeably as “fabrication” or“manufacturing”) of an electronic device according to some exampleembodiments. As used herein, a system 1301 may be referred to as a“set.”

Referring to FIG. 7, system 1301 includes a computing device 3010 (alsoreferred to herein interchangeably as an electronic device), amanipulator device 3040, composition (e.g., gas, fluid, etc.) sources3030-1 to 3030-N (where N is a positive integer), a heat source 3060,and a process chamber 3020.

Referring first to the computing device 3010, the computing device 3010may include processing circuitry 3012 (also referred to herein as simplya processor), memory 3014, a power supply 3015, and a communicationinterface 3016 that are communicatively and/or electrically coupledtogether via a bus 3011.

The computing device 3010 may be included in one or more variouselectronic devices, including, for example, a mobile phone, a digitalcamera, a sensor device, or the like. In some example embodiments, thecomputing device 3010 may include one or more of a server, a mobiledevice, a personal computer (PC), a tablet computer, a laptop computer,a netbook, some combination thereof, or the like. A mobile device mayinclude a mobile phone, a smartphone, a personal digital assistant(PDA), some combination thereof, or the like. The computing device 3010may be referred to herein as simply “processing circuitry.”

The memory 3014, the processing circuitry 3012, the power supply 3015,and the communication interface 3016 may communicate with one anotherthrough the bus 3011.

The communication interface 3016 may communicate data to and/or from anexternal device using various communication protocols. In some exampleembodiments, the communication interface may be connected to anelectronic line (e.g., wire) and may be configured to receive andprocess electrical signals from one or more external devices.

The processing circuitry 3012 may execute a program and control one ormore aspects of the system 1301, via the communication interface 3016 asshown in FIG. 7. A program code to be executed by the processingcircuitry 3012 may be stored in the memory 3014.

The memory 3014 may store information. The memory 3014 may be a volatileor a nonvolatile memory. The memory 3014 may be a non-transitorycomputer readable storage medium. The memory may store computer-readableinstructions that, when executed, cause the execution of one or moremethods, functions, processes, etc. as described herein. In some exampleembodiments, the processing circuitry 3012 may execute one or more ofthe computer-readable instructions stored at the memory 3014 to causethe system 1301 to perform some of all of the methods described herein,including the method illustrated in FIGS. 6A-6B and/or FIG. 10, and/orany method for forming (e.g., “fabricating,” “manufacturing,” etc.) anyelectronic devices according to any of the example embodiments.

In some example embodiments, the communication interface 3016 mayinclude a USB and/or HDMI interface. In some example embodiments, thecommunication interface 3016 may include a wireless communicationinterface.

Still referring to FIG. 7, the process chamber 3020 may be any of theprocess chambers described herein and may include a pedestal and/orchuck 3022 that is configured to structurally support a substrate 3050upon which an electronic device 4000 (which may be any of the exampleembodiments of electronic devices according to any of the exampleembodiments described herein) according to any of the exampleembodiments may be formed (e.g., “fabricated,” “manufactured,” etc.). Insome example embodiments, the substrate 3050 may be at least a portionof a substrate, first electrode, or the like that is at least partiallyincluded in the electronic device 4000 according to any exampleembodiments (e.g., substrate 110, substrate 210, first electrode 310,substrate 410, or the like). As shown, the pedestal and/or chuck 3022may be coupled to a motor such that the electronic device 3010 (e.g.,“processing circuitry”) may be configured to cause the pedestal and/orchuck 3022 to move, via control signals communicated from communicationinterface 3016, for example to enable the substrate 3050 and/orelectronic device 4000 to be moved within, into, and/or out of theprocess chamber 3020.

Still referring to FIG. 7, system 1301 includes a manipulator device3040, which may be any device for manipulating thin-film structuresand/or substrates into and/or out of a process chamber 3020, and theprocess chamber 3020 may include a portal 3021 (e.g., door) via whichthe manipulator device 3040 may access the interior of the processchamber 3020 to provide a substrate 3050 and/or to retrieve at least anelectronic device 4000 formed therein. As shown, the manipulator device3040 and the portal 3021 may be controlled by the electronic device 3010(e.g., “processing circuitry”).

Still referring to FIG. 7, the system 1301 includes one or morecomposition sources 3030-1 to 3030-N (N being a positive integer) whichmay store various materials, including any materials, dopants, and/orcompositions described herein, or any combination thereof, as describedherein. The materials may be stored as a gas, as a liquid, as a solid,as any type of fluid, or any combination thereof. As shown, eachseparate composition source is coupled to the process chamber 3020 via aseparate supply control device 3032-1 to 3032-N (e.g., control valve),where each control device 3032-1 to 3032-N is configured (e.g., based onbeing a control valve) to control a supply of a separate material heldin a separate (e.g., corresponding) coupled composition source 3030-1 to3030-N to the process chamber. The composition sources 3030-1 to 3030-Nand/or control devices 3032-1 to 3032-N may be controlled by electronicdevice 3010 (e.g., “processing circuitry”).

Still referring to FIG. 7, system 1301 includes a heat source 3060,which may be a heating device, heating element, heater, or the like thatmay be utilized to generate heat and provide the generated heat to theprocess chamber 3020 (e.g., to heat at least a portion of the processchamber 3020), for example implement annealing of an amorphousdielectric material layer as described herein. As shown, the heat source3060 may be controlled by the electronic device 3010 (e.g., “processingcircuitry”).

As shown in FIG. 7, the electronic device 3010 (e.g., “processingcircuitry”) may, for example based on processing circuitry 3012executing a program of instruction stored on memory 3014, communicatewith various elements of the system 1301 via communication lines 3018 tocause the system 1301 to form an electronic device 4000 according to anyexample embodiments herein (e.g., form any of the electronic devices100, 200, 300, 400 as described herein with regard to any exampleembodiments, including any of the methods described herein withreference to FIGS. 6A-6D). It will be understood that the system 1301may omit one or more of the elements shown in FIG. 7 (e.g., the heatsource 3060, the pedestal or chuck 3022, or the like).

FIG. 8 shows a schematic of an electronic device according to someexample embodiments.

As shown, the electronic device 1400 includes one or more electronicdevice components, including a processor (e.g., processing circuitry)1420 and a memory 1430 that are communicatively coupled together via abus 1410. The electronic device 1400 may be referred to herein as a“computing device.”

The processing circuitry 1420, may be included in, may include, and/ormay be implemented by one or more instances of processing circuitry suchas hardware including logic circuits, a hardware/software combinationsuch as a processor executing software; or a combination thereof. Forexample, the processing circuitry 1420 may include, but is not limitedto, a central processing unit (CPU), an application processor (AP), anarithmetic logic unit (ALU), a graphic processing unit (GPU), a digitalsignal processor, a microcomputer, a field programmable gate array(FPGA), a System-on-Chip (SoC) a programmable logic unit, amicroprocessor, or an application-specific integrated circuit (ASIC),etc. In some example embodiments, the memory 1430 may include anon-transitory computer readable storage device, for example a solidstate drive (SSD), storing a program of instructions, and the processingcircuitry 1420 may be configured to execute the program of instructionsto implement the functionality of the electronic device 1400.

In some example embodiments, the electronic device 1400 (e.g.,“computing device”) may include an electronic device (e.g., logictransistor) according to any of the example embodiments in one or moreof the processing circuitry 1420 or the memory 1430, where saidelectronic device includes at least a dielectric layer including crystalgrains having aligned crystal orientations, and where said electronicdevice including the dielectric layer is included. Said electronicdevice included in the electronic device 1400 (e.g., “computing device”)may include a ferroelectric substance. The electronic device 1400 (e.g.,“computing device”) may exhibit improved operational performance as aresult, e.g., based on one or more portions of the electronic device1400 (e.g., the processing circuitry 1420 and/or memory 1430) havingimproved characteristics.

FIG. 9 shows a schematic of a system 1500 configured to control theformation of an electronic device (e.g., “computing device”) accordingto some example embodiments, and FIG. 10 is a flowchart illustrating amethod implemented by the system 1500 to manufacture an electronicdevice (e.g., “computing device”) according to some example embodiments.As shown, the system 1500 may include system 1301, which is configuredto form one or more electronic devices 4000 according to any of theexample embodiments of the inventive concepts (S1602), including formingone or more electronic device 4000 that include electronic device 400according to the method shown in FIGS. 6A-6D. In some exampleembodiments, where the one or more electronic devices formed at S1602are configured to be incorporated into a separate electronic device(e.g., “computing device”, such as electronic device 1400), the one ormore electronic devices formed at S1602 may be referred to as“sub-devices.” For example, an electronic device 4000 formed based onsystem 1301 implementing a method for forming an electronic device(e.g., the method as shown in FIGS. 6A-6D) may be a logic transistorthat is configured to be incorporated into an electronic device that isa computing device (e.g., electronic device 1400 as shown in FIG. 8).The system 1500 further includes a fabrication assembly 1504 that isconfigured to incorporate the electronic device(s) formed by system 1301(e.g., electronic device 400) with various electronic device (e.g.,“computing device”) sub-components 1502 (where the sub-components 1502may include printed circuit boards, power supplies, buses, communicationinterface components, processing circuitry components, memorycomponents, any combination thereof, or the like). The fabricationassembly 1504 may incorporate the electronic device(s) 4000 that aresub-device(s) with the sub-components 1502 (S1604), to fabricate(“manufacture”) electronic device (e.g., “computing device”) components(e.g., processing circuitries 1420, memories 1430, any combinationthereof, or the like) and/or electronic devices (e.g., “computingdevice”) themselves, to manufacture (“fabricate”) separate electronicdevice(s) 1400 (e.g., “computing devices”) that include one or moreelectronic devices (e.g., electronic devices 100, 200, 300, and/or 400)according to any example embodiments of the inventive concepts (S1606).Such incorporation (S1604) and manufacturing (S1606) may include, forexample, assembling an electronic device (e.g., “computing device”)component (e.g., processing circuitry 1420 and/or memory 1430 based onincorporating said electronic devices to additional electronic devicesub-components, etc.) based on coupling the electronic device(s) 4000 toone or more electronic device sub-components and coupling the electronicdevice component to other electronic device components (e.g., printedcircuit board, or PCB) to manufacture the electronic device (e.g.,1400).

While some example embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.

What is claimed is:
 1. An electronic device, comprising: a substrate; adielectric layer on the substrate, the dielectric layer includingcrystal grains having aligned crystal orientations; and a gate electrodeon the dielectric layer.
 2. The electronic device of claim 1, furthercomprising: a channel layer on the substrate, wherein the channel layeris overlapped with the gate electrode in a direction that isperpendicular to a top surface of the substrate, and a source and adrain are provided on opposite sides of the channel layer in a directionthat is parallel to the top surface of the substrate.
 3. The electronicdevice of claim 2, wherein the channel layer includes at least one ofSi, Ge, SiGe, Group III-V semiconductors, oxide semiconductors, nitridesemiconductors, oxynitride semiconductors, 2D semiconductor materials,quantum dots, or organic semiconductors.
 4. The electronic device ofclaim 1, wherein the dielectric layer includes a ferroelectricsubstance.
 5. The electronic device of claim 1, wherein the dielectriclayer includes an oxide of at least one of Hf, Si, Al, Zr, Y, La, Gd, orSr.
 6. The electronic device of claim 5, wherein the dielectric layerfurther includes a dopant.
 7. The electronic device of claim 1, whereinthe dielectric layer has a thickness, in a direction that isperpendicular to a top surface of the substrate, of about 0.5 nm toabout 4 nm.
 8. The electronic device of claim 1, wherein the crystalgrains have <111> crystal orientations.
 9. The electronic device ofclaim 1, further comprising: an amorphous dielectric layer or acrystalline dielectric layer between the substrate and the dielectriclayer, between the dielectric layer and the gate electrode, orcombinations thereof, wherein the crystalline dielectric layer includescrystal grains having crystal orientations that are different from thealigned crystal orientations of the crystal grains of the dielectriclayer.
 10. The electronic device of claim 9, wherein the amorphousdielectric layer includes an oxide of at least one of Hf, Si, Al, Zr, Y,La, Gd, or Sr.
 11. The electronic device of claim 9, wherein thecrystalline dielectric layer includes a 2D insulator material.
 12. Anelectronic device comprising: a first electrode and a second electrodeisolated from direct contact with each other; and a dielectric layerbetween the first electrode and the second electrode, wherein thedielectric layer includes crystal grains having aligned crystalorientations.
 13. The electronic device of claim 12, wherein the firstelectrode and the second electrode include crystal grains having crystalorientations that are different from the aligned crystal orientations ofthe crystal grains of the dielectric layer.
 14. The electronic device ofclaim 12, wherein the dielectric layer includes a ferroelectricsubstance.
 15. The electronic device of claim 12, further comprising: anamorphous dielectric layer or a crystalline dielectric layer between thefirst electrode and the dielectric layer, between the second electrodeand the dielectric layer, or combinations thereof, wherein thecrystalline dielectric layer includes crystal grains having crystalorientations different from the aligned crystal orientations of thecrystal grains of the dielectric layer.
 16. A method of manufacturing anelectronic device, the method comprising: preparing a substrate having achannel layer; forming a dielectric layer on the channel layer, whereinthe dielectric layer includes crystal grains having aligned crystalorientations; and forming a gate electrode on the dielectric layer. 17.The method of claim 16, further comprising: forming an amorphousdielectric layer or a crystalline dielectric layer between the substrateand the dielectric layer, between the dielectric layer and the gateelectrode, or combinations thereof, wherein the crystalline dielectriclayer includes crystal grains having crystal orientations different fromthe aligned crystal orientations of the crystal grains of the dielectriclayer.
 18. The method of claim 16, wherein the forming of the dielectriclayer includes depositing an amorphous dielectric material layer on thechannel layer, and then crystallizing the amorphous dielectric materiallayer to form the dielectric layer, such that the crystallized amorphousdielectric material layer includes the crystal grains having the alignedcrystal orientations.
 19. The method of claim 16, wherein the dielectriclayer includes a ferroelectric substance.
 20. The method of claim 16,wherein the dielectric layer has a thickness of about 0.5 nm to about 4nm.
 21. A method of manufacturing a computing device, the methodcomprising: manufacturing an electronic device according to the methodof claim 18; and forming the computing device based on incorporating theelectronic device into a computing device component.
 22. The methodaccording to claim 21, wherein the computing device component includesat least one of a processing circuitry or a memory.
 23. A method ofmanufacturing an electronic device, the method comprising: forming adielectric layer on a first electrode, the first electrode including aconductive metal, the dielectric layer including crystal grains havingaligned crystal orientations; and forming a second electrode on thedielectric layer, the second electrode including the conductive metal.24. The method according to claim 23, further comprising: forming atleast one amorphous dielectric layer between the first electrode and thedielectric layer, between the dielectric layer and the second electrode,or combinations thereof.
 25. The method according to claim 23, furthercomprising: forming at least one crystalline dielectric layer betweenthe first electrode and the dielectric layer, between the dielectriclayer and the second electrode, or combinations thereof, wherein the atleast one crystalline dielectric layer includes crystal grains havingcrystal orientations different from the aligned crystal orientations ofthe crystal grains of the dielectric layer.
 26. The method according toclaim 23, wherein the forming of the dielectric layer includesdepositing an amorphous dielectric material layer on the firstelectrode, and then crystallizing the amorphous dielectric materiallayer to form the dielectric layer, such that the crystallized amorphousdielectric material layer includes the crystal grains having the alignedcrystal orientations.
 27. A method of manufacturing a computing device,the method comprising: manufacturing an electronic device according tothe method of claim 23; and forming the computing device based onincorporating the electronic device into a computing device component.28. The method according to claim 27, wherein the computing devicecomponent includes at least one of a processing circuitry or a memory.29. A system for manufacturing an electronic device, the systemcomprising: a process chamber including a pedestal or chuck configuredto structurally support one or more devices or layers in the processchamber; a plurality of composition sources and a plurality of controldevices, each composition source coupled to the process chamber via aseparate control device, each control device configured to control asupply of a separate material held in a separate coupled compositionsource to the process chamber; and processing circuitry configured tocontrol at least the plurality of control devices to manufacture theelectronic device based on preparing a substrate having a channel layeron the pedestal or chuck, forming a dielectric layer on the channellayer, wherein the dielectric layer includes crystal grains havingaligned crystal orientations, and forming a gate electrode on thedielectric layer.
 30. The system of claim 29, wherein the processingcircuitry is further configured to control at least the plurality ofcontrol devices to form at least one amorphous dielectric layer betweenthe substrate and the dielectric layer, between the dielectric layer andthe gate electrode, or combinations thereof.
 31. The system of claim 29,wherein the processing circuitry is further configured to control atleast the plurality of control devices to form at least one crystallinedielectric layer between the substrate and the dielectric layer, betweenthe dielectric layer and the gate electrode, or combinations thereof,wherein the at least one crystalline dielectric layer includes crystalgrains having crystal orientations different from the aligned crystalorientations of the crystal grains of the dielectric layer.
 32. Thesystem of claim 29, wherein the forming of the dielectric layer includesdepositing an amorphous dielectric material layer on the channel layer,and then crystallizing the amorphous dielectric material layer to formthe dielectric layer, such that the crystallized amorphous dielectricmaterial layer includes the crystal grains having the aligned crystalorientations.